Our FIB & SEM Service Advantage
A). We are from China, we have better price.
B). Far away from you, your project is much confidential with us.
C). Have 20+ years of experience in serving the semiconductor reverse engineering sector.
Focused Ion Beam Circuit Edit
Focused Ion Beam, or FIB circuit edit services allow the customer to cut traces or add metal connections within a chip. Our services include sample preparation, sample analysis, fault isolation, and actual circuit modifications. These circuit edits could support basic electrical design characterization or verification of redesign parameters.
Focused ion beam circuit edits can be done quickly and easily, at a small fraction of the cost of a new lot of wafers in a fab. Circuit edits are often performed once a design flaw has been identified, to ensure that the proposed fix will solve the complete problem. With our state of the art equipment and specialized techniques, we can edit circuits at advanced process nodes such as 28nm, 20nm and 14 nm with multiple layer metal stacks as well as back side editing for flip chip packages.
our FIB Circuit Edit service includes
a. Laser Decap
b. Metal deposition
c. Dielectric deposition
d. Metal and dielectric etch
Focused ion beam Circuit Edit Wiki
Circuit Edit involves the modification of existing ICs or electronic chips using focused ion beam technique. For example after tape out of the chip it can occur that the device does not function as it should. In that case, the designer can modify the circuit’s design and produce a new chip. This is a very expensive and time-consuming job (at least a few months). It is justified to spend a few $1000 to verify this re-design first. This means an adjustment is done to the physical chip. Subsequently it is investigated whether this has the desired result.
While FIB systems are used in a number of applications throughout multiple industries, their primary use for semiconductors is circuit modification, that is, cutting traces and depositing localized metal connections or insulators (Fig. 1). Using today’s latest equipment, it is possible to edit circuits fabricated with 28 nm and smaller technology nodes that feature multiple-layer metal stacks and occupy flip chip and other advanced chip-scale form factors.
A circuit edit can be for example the removal of a functional block of circuit that is using too much power. Or we can make a connection so that a given signal is shorted. An edit can be for example the removal of a material such as the cutting of a metal track, but also the deposition of a conductive material so that a new electrical connection is realized. Not forget to mention we are talking about very small dimensions. Cutting traces of 200 nm is no exception. The figure below shows a cross section of a completed cicuit edit on a real chip. Two metal traces are connected to each other at points a and b. This type of connections are
A finely focused gallium ion beam with nanoscale resolution is used to perform FIB circuit edit and enable operators to image, etch, and deposit materials Fig. 1 Multiple connections and cuts for frontside FIB circuit edit on an IC with an extremely high level of precision. Volume 16 No. 3 21 Circuitry is cut and connected within a functional device by removing and depositing materials. This process is also used to create probe points for electrical test. The high-energy gallium beam can mill through conductors; it uses various gas-based chemistries to either enhance milling precision or more effectively deposit conductive and dielectric materials. For instance, by selecting appropriate gases, a choice of tungsten, platinum, or silicon dioxide can be very precisely deposited using the ion beam
also mentioned as vias. Next, both of these vias are connected by a strap c. This local connection consists of a metal deposition; often this is platinum or tungsten, but it can also be another material such as molybdenum. In the figure also a cut is shown at location d. After cutting the line the hole is filled with TEOS deposition which is insulating. A circuit edit job can contain multiple of these actions. A designer should always consider to have as less edits possible on one device. This because each single step is carrying risk of damaging the device. There is not much needed to destroy a sub- micron structure.
The FIB tool is coupled to a computer-aided design (CAD) navigation system, making it possible to locate the area of interest. The designer’s graphic display system (GDS) files are typically used to navigate to a precise area. This provides a method to find subsurface features and ensure that the correct edits are made (Fig. 2). Accurate beam positioning is one of the most critical requirements for FIB circuit edit.
Beside circuit edit we also use FIB to apply FIB probe- or bond pads. This to create and connect it randomly to signals on the chip. We are capable to deposit metals straps while insitu measure the resistance. This application can be very useful during Failure Analysis of a chip for fabless semiconductor companies or IDMs.